MacuSpec™ HT 200

Direct Current (DC) acid copper plating system that delivers High-Throwing (HT) power for high aspect ratio through holes.

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Product Overview

MacuSpec HT 200 is specifically formulated to deliver high microdistribution at higher current densities, enabling increased throughput. This makes it an excellent choice for continuous vertical plating systems. It produces a bright, smooth, and ductile copper deposit within a current density range of 5 to 30 ASF and is capable of plating through holes with aspect ratios up to 10:1. The mechanical properties of the deposit exceed Institute of Printed Circuit Board (IPC) specifications across the entire current density range.

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