MacuSpec™ PPR 100 & 200
Pulse plating processes that enable precise thickness uniformity, reliable thermal cycle performance, and superior throwing power.
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Product Overview
MacuSpec PPR 100 and 200 are industry-leading pulse plating processes trusted by fabricators worldwide who demand precise thickness uniformity and overall productivity that conventional acid copper plating cannot achieve. These processes are designed for the metallization of high-tech panels with through-hole aspect ratios approaching 30:1.
Product Features
Exceptional Thickness Uniformity
Uniform copper distribution allows for a reduction in dry film thickness, resulting in lower operating costs.
Reliable Thermal Cycle Performance
Increased thermal cycling performance for enhanced reliability in today’s multilayer Printed Circuit Boards (PCBs).
Superior Throwing Power
The processes provide superior throwing power into high-aspect ratio through-holes, reducing plating time by up to 70%.
High Productivity at Lowest Cost of Ownership
MacuSpec PPR 100 and 200 deliver a more consistent electrolytic deposit, faster than traditional direct current methods, enabling users to increase output. The processes allow for plating a desired thickness in the center of the hole while plating less copper on the outer surface of the printed circuit board. This greatly reduces the consumption of copper anodes and allows for thinner dry film resists.
Exceptional Throwing Power for Complex Designs
The MacuSpec PPR 100 and 200 processes successfully plate high-aspect-ratio through-holes and blind microvias simultaneously, without the need for multiple plating cycles.
Featured Applications
Complex PCB Designs
Excellent thickness uniformity, reliable thermal cycle performance, and superior throwing power for the most challenging plating specifications.