MacuSpec™ HT 300
Advanced DC acid copper plating system that provides pulse-like performance for thicker mid-range through-hole metallization.
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MacuSpec HT 300 is a high-throw Direct Current (DC) acid copper plating process that delivers pulse plating–like performance on thicker boards using standard DC equipment. It produces deposits with exceptional brightness, ductility, and uniformity in through holes with aspect ratios up to 15:1, enabling fabricators to produce higher technology boards without upgrading their rectification to pulse.
This process is ideal for through-hole plating, conformal blind via plating, and pattern plating applications. The deposit exceeds IPC Class 3A tensile strength and elongation requirements and passes all thermal reliability tests, ensuring dependable device performance. MacuSpec HT 300 is analyzable by Cyclic Voltammetric Stripping (CVS) and common analytical tools, supporting excellent operational control, long bath life, and improved product quality.