MacuSpec™ VF-TH Series
Copper plating baths that can simultaneously fill copper microvias and plate through holes with aspect ratios of up to 8:1.
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Product Overview
The MacuSpec VF-TH Series consists of copper plating baths that can simultaneously fill copper microvias and plate through-holes with aspect ratios up to 5:1 across a wide range of structure sizes, delivering excellent physical properties. Designed for use in Vertical Conveyor Plating (VCP) or pattern plating modes, the VF-TH Series offers all the advantages of our VF Series baths without the need for pre-dip or flash plating process steps.
Product Features
Superior Physical Properties
Copper deposits meet IPC 6012D, DS, and 6013D standards, which require a tensile strength of at least 40,000 PSI and elongation of no less than 18%.
Excellent Via Filling
The MacuSpec VF-TH Series delivers superior via filling with throwing power of 80–90% in 6:1 aspect ratio holes on boards up to 0.8 mm thick, with no knee thinning.
Consistent Reliability Performance
MacuSpec VF-TH technology reduces process steps without compromising reliability.
MacuSpec VF-TH 500
MacuSpec VF-TH 500 is the latest innovation in the award-winning VF-TH Series of plating processes. It enables high-performance via filling and through-hole plating, offering excellent results for large, deep microvia filling. The technology is capable of filling laser-drilled through-vias on AR 6 through holes with 1.2mm thick panels.
MacuSpec VF-TH 300
This pattern plating process for Modified Semi-Additive Process (mSAP) and Semi-Additive Process (SAP) fills microvias and laser-drilled X-vias while plating through-holes in a single step. The MacuSpec VF-TH 300 deposit is formulated to minimize V-pit formation after final etching, even without a baking step, resulting in higher process yields.
MacuSpec VF-TH 200
Developed from patented technologies and refined technical expertise, MacuSpec VF-TH 200 simultaneously fills vias and plates through-holes with electrolytic copper featuring excellent physical properties across a wide range of structure sizes. The process enables filling vias from 3x3 to 5x4 mil while plating through-holes to exact specifications in the same bath.
Featured Applications
High Density Interconnects
These multifunctional processes for mSAP and SAP deliver enhanced reliability and quality, faster production times, and superior filling performance for high-density interconnect plating.
Product Documentation
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