MacuSpec™ HT 360
State-of-the-art DC acid copper plating process that enables high-throw, high-volume production with no need for pulse plating.
Contact UsProduct Overview
MacuSpec HT 360 is a state-of-the-art Direct Current (DC) acid copper plating process that offers greater throwing power at current densities up to 35 ASF in through holes with aspect ratios up to 12:1. The increased throwing power and higher current density provide greater throughput while minimizing excess surface copper, helping to extend the capabilities of DC plating.
Product Features
Superior Production Capacity
Unsurpassed production capacity for DC plating of multilayer boards with aspect ratios up to 12:1.
Excellent Plating Performance
MacuSpec HT 360 is capable of plating copper with exceptional brightness, ductility, and uniformity.
Exceptional Microdistribution
Excellent microdistribution at high current densities of up to 35 ASF.
Enhanced Product Reliability and Quality
The MacuSpec HT 360 deposit exceeds IPC Class 3A tensile strength and elongation requirements and passes all thermal reliability testing, ensuring dependable device performance. It is analyzable by Cyclic Voltammetric Stripping (CVS) and other common analytical tools, offering excellent operational control, extended bath life, and improved product quality.
Low Cost, High Productivity, High Performance
MacuSpec HT 360 is specially engineered to be a drop-in replacement for existing DC acid copper lines with soluble or inert anodes. As a result, there is no need to purchase new equipment or invest in expensive pulse plating rectification.
Featured Applications
Mobile Devices
MacuSpec HT 360 provides enhanced thermal reliability, ensuring dependable mobile device performance.
Automotive
MacuSpec HT 360 deposits surpass all IPC specifications for through-hole metallization in multilayer board production for advanced automotive applications.