MacuSpec™ VF Series

Via filling copper metallization solutions that provide the most stable and consistent via filling available on the market today.

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Product Overview

The MacuSpec VF Series via-fill copper metallization solutions have been the production-proven standard for more than 20 years, supporting electronic devices used worldwide. With tailored options to suit a wide range of High-Density Interconnect (HDI) applications, MacuSpec VF processes deliver the most stable and consistent via filling available in the market today.

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