MacuSpec™ AVF Series
Advanced via fill copper metallization processes for high-density interconnects.
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The MacuSpec AVF series is an advanced family of via-fill copper metallization processes designed for high-density interconnects. AVF technology enables minimal surface copper across a wide range of plating conditions. Its unique combination of chemical formulation and equipment parameters allows for the plating of a broad range of blind micro via sizes in a single bath—eliminating the need for a flash plate.
The filled micro vias produced by the AVF series offer exceptional repeatability and meet the IPC 6012D 3.2.6.2 standard.