354 results for "Alpha"
Surface Mount Technology
Enable complex board designs with reliable Surface Mount Technology (SMT) solder solutions, optimizing electronics assembly processes.
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MICROFAB® SN-300/302
High-speed low-alpha pure tin plating process produces compact grain structures and uniform surface morphology.
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Acid copper plating system designed for simultaneous plating of RDL lines and via filling across a wide range of geometries.
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High-speed copper plating process for copper pillars in flip chip packages, microbumps in 3D interconnects, and RDL.
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High-purity electroplating process produces equiaxed-grained matte copper deposits for bump/pillar fabrication.
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High-performance copper process provides superior coplanarity and exceptional within-die, and within-feature uniformity.
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Pure copper process with high KV resistance, engineered for copper pillar, copper stud and Under-Bump Metallization (UBM) applications.
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High-speed copper plating process for copper pillars in flip chip packages, copper microbumps in 3D interconnects, and RDL.
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Acid copper plating process offers excellent throwing power, improved leveling characteristics, and ductile, low-stress deposits.
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Copper plating solution provides superior coplanarity in a low KV system and exceptional uniformity.
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