MICROFAB® SPM-1100

Copper plating solution provides superior coplanarity in a low KV system and exceptional uniformity.

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Product Overview

The MICROFAB SPM-1100 copper plating solution offers high-speed plating and coplanarity in a Kirkendall Void (KV) low system, providing excellent within-wafer, within-die, and within-feature uniformity. It is specifically engineered for high-speed pillar, copper stud, and Under-Bump Metallization (UBM) applications.

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