MICROFAB® SC-32

Acid copper plating process offers excellent throwing power, improved leveling characteristics, and ductile, low-stress deposits.

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Product Overview

The MICROFAB SC-32 acid copper plating process is designed for copper pillars in flip chip packages, copper microbumps, and redistribution layers. It delivers accurate bump height uniformity and shape control, with higher plating rates compared to MICROFAB SC.

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