MICROFAB® SN-300/302
High-speed low-alpha pure tin plating process produces compact grain structures and uniform surface morphology.
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The MICROFAB SN-300/302 process is a high-speed, Methanesulfonate (MSA)-based pure tin plating solution. It produces fine-grained, matte to semi-bright pure tin deposits. The formulation is designed to provide excellent thickness distribution across the wafer and uniform alloy distribution for wafer bumps.