Solder Paste Materials
for Printed Circuit Boards (PCB)

Advanced PCB solder paste materials and solutions designed to meet the evolving demands of electronics assembly.

 

Improve Your Electronics Production Efficiency

Meticulously developed solder pastes designed to address key challenges in electronics assembly, including electrochemical reliability, miniaturization, high throughput, and yield, while offering a wide processing window to reduce Total Cost of Ownership (TCO).

 

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ALPHA® CVP-390V Innolot MXE Solder Paste

Next-generation, high-reliability no-clean solder paste engineered to deliver advanced thermomechanical performance.

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ALPHA® CVP-390V Solder Paste

Lead-free, no-clean solder paste, that maximizes process flexibility, ensuring electrochemical reliability in tough applications.

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ALPHA® CVP-520 Solder Paste

Enables low temperature Surface Mount Technology (SMT) assembly technology to minimize rework in multiple reflow applications.

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ALPHA® JP-500

Lead-free, zero halogen, no-clean solder paste suitable for jet printers and approved by leading jetting equipment manufacturers.

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ALPHA® JP-501

A low temperature, lead-free, no-clean solder paste designed for use in jet printers.

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ALPHA® OM-100 SnCX® 07 Solder Paste

Optimized for value, designed for reliability, featuring a silver-free solution that delivers SAC-level performance.

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ALPHA® OM-353 Solder Paste

Broad latitude for high-reliability applications requiring process flexibility and residue containment, lead-free and zero-halogen.

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ALPHA® OM-362 Solder Paste

An ultra-low voiding, high-reliability, Restriction of Hazardous Substances (RoHS) compliant, zero-halogen solder paste.

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ALPHA® OM-377 Solder Paste

Next-Generation Solder Paste for Mobile, Wearable, and Complex Miniaturized Assemblies

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ALPHA® OM-5100 Solder Paste

Low residue, no-clean solder paste designed to maximize first pass yields with a rheologically formulated flux vehicle.

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ALPHA® OM-5300 Solder Paste

A no-clean solder paste that meets the demands of tin-lead soldering when lead-free components are present in circuit assembly.

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ALPHA® OM-565 HRL3 Solder Paste

A zero-halogen, low-temperature flux chemistry, developed specifically for the HRL3 alloy to enable target peak reflow of 175°C.

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Cored Solder Wire (SMT)

Ensure robust performance in critical assemblies with high-reliability cored solder wire designed for primary attach and rework.

 

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Electronic Cleaners (SMT)

Achieve consistent, reliable cleaning results with solutions designed for a variety of assembly applications.

 

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Preforms

Enable reliable electronics packaging with precision preforms delivering volume control, reliability, and performance.

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Solder Alloys

Enable reliable electronics packaging with precision preforms delivering volume control, reliability, and performance.

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Stencil Solutions

Optimize assembly with solutions addressing today’s printing needs through rapid response, high accuracy, and exceptional performance.

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Why MacDermid Alpha?

Integrated Solutions
Our SMT solder paste solutions enhance PCB assembly reliability, streamline manufacturing processes, and simplify global supply chains through deep technical expertise and worldwide support. Engineered for superior print performance, reduced defects, and consistent solder joint quality, these materials improve yield and efficiency while supporting sustainable electronics manufacturing through reduced waste, optimized reflow, and RoHS-compliant production.

Sustainability
Our sustainable SMT solder paste technologies reduce environmental impact while maintaining high soldering performance and reliability in PCB assembly. Designed for eco-friendly electronics manufacturing, these materials support lower energy consumption, reduced waste, and RoHS-compliant production. They help manufacturers improve process efficiency, meet ESG objectives, and achieve consistent, high-quality assembly performance.

Reliability
Our advanced SMT solder paste solutions deliver superior performance and long-term reliability for high-performance, ruggedized electronics applications. Engineered for excellent print stability, reduced voiding, and strong solder joint integrity, these materials improve thermal cycling resistance and manufacturing consistency. Ideal for automotive, aerospace, industrial, and high-reliability PCB assembly environments requiring durable, dependable performance.

Circuit Board Assembly

Frequently Asked Questions

Are MacDermid Alpha solder pastes compliant with RoHS, REACH, and global electronics manufacturing regulations?

Yes, the majority of MacDermid Alpha SMT solder pastes are RoHS and REACH compliant, supporting global environmental and regulatory requirements for electronics manufacturing. These compliant solder paste solutions are designed to help PCB assemblers reduce hazardous substances while maintaining high solder joint reliability, print performance, and process consistency. Ideal for automotive, industrial, aerospace, medical, and consumer electronics applications, they support sustainable, high-reliability PCB assembly and help manufacturers meet evolving ESG and compliance objectives. For specific regional regulations, material declarations, or product compliance documentation, customers can contact their local MacDermid Alpha representative for detailed technical and regulatory support.

How does solder paste improve SMT PCB assembly performance and reliability?

Solder paste improves PCB assembly processes by enabling consistent, high-quality solder joint formation across a wide range of SMT manufacturing conditions. Advanced solder paste chemistries offer a broad process window, excellent printability, and stable reflow performance, helping manufacturers increase throughput and reduce defects such as voiding, bridging, and insufficient wetting. This leads to improved first-pass yield, enhanced solder joint reliability, and lower rework and warranty costs. Designed for high-reliability electronics manufacturing, these materials support efficient stencil printing, precise component placement, and robust process control in automotive, industrial, aerospace, and consumer electronics applications requiring scalable, high-performance SMT assembly.

Do you offer ultra-low voiding solder paste for QFN and QFP thermal pad applications?

Yes, we offer ultra-low voiding solder paste solutions specifically engineered to reduce voiding in SMT assembly for components with large thermal pads, such as QFNs (Quad Flat No-Leads) and QFPs (Quad Flat Packages). These advanced formulations consistently achieve voiding levels below 10%, improving thermal conductivity, solder joint reliability, and long-term electrical performance. Optimized for high-reliability PCB assembly, they enhance reflow performance, reduce defects, and improve process yield in demanding automotive, industrial, and consumer electronics applications. This helps manufacturers achieve better heat dissipation, improved device reliability, and more consistent results in complex surface mount technology (SMT) processes.

What solder paste powder particle sizes (Type 3–Type 6) are available for SMT assembly applications?

We offer a wide range of solder paste powder particle size distributions, from Type 3 through Type 6, to support diverse SMT and PCB assembly requirements. This enables manufacturers to select the optimal powder type based on stencil design, aperture size, and fine-pitch or ultra-fine-pitch component requirements. Finer powder types, such as Type 5 and Type 6, are ideal for advanced miniaturized electronics, while Type 3 and Type 4 support standard SMT applications. These options help improve printability, reduce defects, enhance solder joint reliability, and ensure consistent performance across high-reliability automotive, industrial, and consumer electronics manufacturing processes.

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