ALPHA® OM-362 Solder Paste
An ultra-low voiding, high-reliability, Restriction of Hazardous Substances (RoHS) compliant, zero-halogen solder paste.
Contact UsProduct Overview
ALPHA OM-362 is a lead-free, zero-halogen, no-clean solder paste available in T4 powder. It is specifically designed to deliver ultra-low voiding performance across all component types, with a focus on bottom-terminated components.
ALPHA OM-362 achieves Institute of Printed Circuit Board (IPC) Class III voiding on Ball Grid Array (BGA) components, and less than 10% average voiding on Bottom Terminated Components (BTC). This paste is engineered for ultra-low voiding performance with high-reliability alloys such as Innolot® and traditional Tin-Silver-Copper (SAC) alloys.
Product Features
Ultra-Low Voiding Performance
Excellent Electromigration Characteristics
Good Coalescence and Wetting Performance
Excellent Solder Joint and Flux Residue Cosmetics
Zero-Halogen, No Halogens Intentionally Added
Ultra-Low Voiding Performance
Increases process stability, thermal performance, and electrical performance for the most demanding component applications.
Excellent Electromigration Characteristics on Large Bottom Terminated Components (BTC)
Passes IPC J-STD-004C and IPC-TM-650 at 200 μm to ensure electrical reliability and functionality of fine-pitched components.
