ALPHA® JP-501
A low temperature, lead-free, no-clean solder paste designed for use in jet printers.
Contact UsProduct Overview
The low-temperature, lead-free alloy in ALPHA JP-501 has a melting point of 138°C and has been successfully used with peak reflow profiles between 155°C and 190°C. The flux residue from ALPHA JP-501 is clear and colorless, and is formulated to provide high electrical reliability in a zero-halogen flux formulation.
ALPHA JP-501 offers an outstanding reflow process window across all traditional surface finishes and is rated ROL0 per IPC J-STD-004. All components used with SnBi solders must be lead-free to prevent the formation of tin/lead/bismuth intermetallics, which have a melting point under 100°C.
Product Features
Low Temperature Reflow Profiles Enable the Use of Low Tg PCBs
Excellent Deposit Consistency
Excellent deposit consistency with high process capability index across all board designs.
Reduction in Random Solderballing Levels
Excellent Pin-Test Yield for Single and Double Reflow
Available in Type 5 Powder
Excellent Deposit Consistency
ALPHA JP-501 is capable of consistently depositing down to 125µm, making it ideal for tight design spacing as well as volume additions in complex Printed Circuit Board (PCB) assemblies.
ALPHA JP-501 is also qualified for use on leading jet manufacturing equipment.
Low Temperature Solder Pastes
Low-temperature solder pastes engineered to meet the latest assembly process requirements driven by new component designs.
