ALPHA® JP-500
Lead-free, zero halogen, no-clean solder paste suitable for jet printers and approved by leading jetting equipment manufacturers.
Contact UsProduct Overview
ALPHA JP-500 is formulated to deliver excellent visual joint cosmetics and is rated ROL0 per IPC J-STD-004. ALPHA JP-500 features a rheology capable of standard dispensing or jetting.
This paste is formulated to offer best-in-class in-circuit pin test yields and high electrochemical reliability. ALPHA JP-500 offers outstanding reflow process window and solderability across all traditional surface finishes.
Product Features
Deposit Capability and Processability of Circular Dimensions
Deposit capability and processability of circular dimensions down to 0.25mm (0.010”).
Excellent Deposit Consistency with High Process Capability Index
Excellent deposit consistency with high process capability index across all board designs.
Reduction in Random Solder Balling Levels, Increasing First-Time Yield
Excellent Pin-Testability
Available in Type 5 and Type 6 Powders
Solder Paste for Jet Printing
Solder pastes designed for use in jet printers, approved by leading jetting equipment manufacturers, and exhibiting excellent deposit consistency.
Excellent Deposit Consistency
ALPHA JP-500 maintains excellent individual dot deposit consistency with an accuracy of 80µm and deposit accuracy of 40µm on a 0603 footprint.
