ALPHA® OM-100 SnCX® 07 Solder Paste
Optimized for value, designed for reliability, featuring a silver-free solution that delivers SAC-level performance.
Contact UsProduct Overview
ALPHA OM-100 SnCX 07 is a silver-free solder paste engineered to deliver Tin-Silver-Copper (SAC) comparable reliability with improved total cost of ownership. Ideal for cost-sensitive applications, this solution increases profitability with every assembly.
With an average 50% improvement in mechanical strain resistance over SAC305-based solder pastes, ALPHA OM-100 SnCX 07 significantly extends the service life of white goods and smart home electronics assemblies, where environmental incursions such as vibration and drop shock are major concerns.
Engineered for both exceptional performance and cost efficiency, this versatile paste maximizes value without compromising reliability.
Product Features
Superior Mechanical Performance
Proven 50% improvement in characteristic life over SAC305 for white goods and smart consumer electronics applications.
Total Cost of Ownership (TCO) Optimization
Offers up to 30% metal savings compared to Tin-Silver-Copper (SAC) based alloys, optimizing total cost of ownership.
TCT Performance
Provides Thermal Cycle Test (TCT) performance comparable to SAC305 for applications operating below 100 °C.
Excellent Processability
Optimized for tighter processing windows and offering up to 16 hours of stencil life.
TCT Performance
Provides thermal cycling test performance comparable to SAC305 for applications operating below 100 °C, meeting the reliability requirements of most white goods and smart home electronics.
Superior Drop Shock Performance
Engineered to deliver a significant improvement in mechanical reliability over conventional alloys, the SnCX 07 alloy provides up to a 40% improvement in drop shock and vibration performance compared to SAC305.
Improved Material TCO
Provides up to 30% metal savings compared to SAC based alloys, optimizing total cost of ownership and increasing profitability.
