ALPHA® OM-565 HRL3 Solder Paste
A zero-halogen, low-temperature flux chemistry, developed specifically for the HRL3 alloy to enable target peak reflow of 175°C.
Contact UsProduct Overview
ALPHA OM-565 HRL3 low-temperature solder paste is designed to mitigate warpage induced defects in temperature-sensitive chip-scale packages. This solder paste enables peak reflow temperatures of 175°C and offers superior wettability to minimize post-reflow defects, such as Non-Wet-Open (NWO) and Head-In-Pillow (HiP).
The ALPHA OM-565 chemistry enhances electrochemical performance compared to existing low-melt point solders and provides excellent compatibility when used in combination with alternative ALPHA solutions for contact rework applications.
Product Features
Compatibility with HRL3 Alloy
Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability.
Enables Peak Reflow Temperature of 175°C
The HRL3 alloy enables a peak reflow temperature of 175°C, effectively mitigating warpage induced defects.
Low Melt Point Reflow
Low melt point reflow improves energy efficiency and reduces energy costs in the assembly process.
Superior HiP/NWO Performance
Compatibility with Contact Rework Applications
8-Hour Stencil Life in Ambient and Elevated Conditions
Minimizes Warpage Induced Defects to Maximize Assembly Yield
Next-generation devices require larger footprints and thinner form-factor designs that deliver superior processing power over existing technologies. These next-generation packages present challenges for assembly at traditional Surface Mount Technology (SMT) reflow temperatures. ALPHA OM-565 HRL3 enables a reduction in peak reflow temperature to 175°C, mitigating common warpage induced defects, such as HiP and NWO, and improving assembly yields.
HRL3 Alloy Improves Reliability Over Existing Low-Temperature Solutions
ALPHA OM-565 HRL3 microalloying additions continue to enhance mechanical reliability over existing best-in-class low-temperature solutions. The resulting ductility of the HRL3 alloy, combined with the superior wettability of the ALPHA OM-565 chemistry, further advances the drop shock performance of low-melt point alloys.
Enhances the Environmental Sustainability of the Assembly Process
The HRL3 alloy offers a significant reduction in peak reflow temperature compared to existing Tin-Silver-Copper (SAC) reflow conditions. The ability to reliably solder at peak temperatures of 175°C increases the efficiency of existing assembly processes while lowering the manufacturer's net impact on the surrounding environment.
