ALPHA® OM-5100 Solder Paste
Low residue, no-clean solder paste designed to maximize first pass yields with a rheologically formulated flux vehicle.
Contact UsProduct Overview
ALPHA OM-5100 Solder Paste is a low-residue, no-clean solder paste designed to maximize first-pass yields. The ALPHA OM-5100 activation system is optimized to enhance joint solderability and minimize post-reflow soldering defects.
This paste's wide reflow profile window enables soldering with lead-free components. ALPHA OM-5100 is engineered for complex assemblies with small (0201) tin-finished passives and ensures solderability with large (1mm pitch) Ball Grid Array (BGA) components containing lead-free spheres. Small print deposits remain fully coalesced, even in profiles hot enough to collapse SAC305 BGA spheres.
Product Features
Consistent Fine-Feature Print Volume Repeatability
Low Post-Reflow Residue
Reduction in Mid-Chip Solder Ball Defects
Minimizes Random Solder Balling
Low Flux Residue Volume Supports Underfill Compatibility
Low residue enables high-throughput underfill processing. Compatibility with leading underfills ensures low underfill voiding and prevents delamination, ensuring the highest mechanical strength of the resulting assembly.
Consistent Fine-Feature Printability
Superior print volume repeatability down to 0.300 mm circles and 0.225 mm deposits. ALPHA OM-5100 exhibits excellent print yields with no dog ears or slump on fine-feature square deposits.
Meets Demands of Tin-Lead Soldering
No-clean solder pastes that meet the demands of tin-lead soldering.
