9 results
STAYSTIK® 181
Silver-filled thermoplastic paste offers strong bonding for electronics, ideal for MCMs, and superior reworkability.
Learn moreSTAYSTIK® 336T
Solvent-based adhesive for temporary bonding, ideal for GaAs/silicon wafer thinning. Debonds with IPA, no residue.
Learn moreSTAYSTIK® 472
A thermoplastic adhesive film that bonds at low temps with a low modulus (60,000 psi).
Learn moreSTAYSTIK® 482
Thermoplastic adhesive film excels in electronics, offering strong bonding for MCMs and better reworkability than thermosets.
Learn moreSTAYSTIK® 571
Silver-filled conductive film bonds well at low temps (60,000 psi modulus), handles different CTEs, and is easily reworked.
Learn moreSTAYSTIK® 581
Silver-filled conductive film offers strong bonding for MCMs and superior reworkability compared to thermosets.
Learn moreSTAYSTIK® 611
Aluminum nitride-filled film resists high temps, ideal for die attach in hermetic packages, with low RGA and reworkability.
Learn moreSTAYSTIK® 672
Aluminum nitride-filled adhesive film for electronics bonds well at low temps, handles different TCEs, and is reworkable.
Learn moreSTAYSTIK® 682
Aluminum nitride-filled thermoplastic film for electronics, offering strong bonding for MCMs and reworkability.
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