STAYSTIK® 336T
Solvent-based adhesive for temporary bonding, ideal for GaAs/silicon wafer thinning. Debonds with IPA, no residue.
Contact UsProduct Overview
A solvent-based polymer specially developed for temporary bonding applications. STAYSTIK 336T thermoplastic adhesive paste is a low-modulus polymer specially developed for temporary bonding applications, most typically associated with GaAs and silicon wafer thinning. It can also be used for various applications where temporary adhesion is necessary. This adhesive can be easily debonded in Isopropyl Alcohol (IPA).
Product Features
Fast Bonding
STAYSTIK® 336T bonds quickly to a variety of substrates, enabling an efficient workflow in production environments.
Reworkable
It can be easily debonded using Isopropyl Alcohol (IPA), leaving no residue or contamination. This makes it ideal for processes that require temporary adhesion.
Low Outgassing and Low Ionics
These properties help prevent contamination, making it suitable for sensitive applications in the aerospace, medical, and electronics industries.
Type
STAYSTIK® 336T is a solvent-based, non-conductive thermoplastic adhesive that provides temporary bonding for various substrates. Its non-conductive nature makes it ideal for electronic and semiconductor applications where electrical insulation is critical.
Format
This adhesive is available in paste form, allowing for precise application and easy handling in industrial processes. The paste consistency ensures uniform coverage and effective adhesion across various substrate surfaces.
Application Temperature
STAYSTIK® 336T is typically used at elevated temperatures to ensure optimal bonding strength. Heat activation enhances its adhesion properties, making it reliable for high-performance applications.
Removal
It can be easily removed with Isopropyl Alcohol (IPA), preserving surface integrity and leaving no residues. This feature facilitates reworking, making it ideal for applications that require clean, temporary bonds.
Featured Applications
Wafer Thinning
Used to secure wafers during thinning, where precision is crucial to avoid damaging delicate semiconductor structures.
Substrate Cutting
Provides temporary bonding for substrates or wafers before cutting, ensuring stability throughout the process.
Lens Polishing
Maintains alignment and stability of components during polishing, which is critical for achieving the required surface finish and accuracy.
Packaging
Effective for temporary bonding during complex packaging processes, including System-In-Package (SiP) and heterogeneous integration.