STAYSTIK® 571
Silver-filled conductive film bonds well at low temps (60,000 psi modulus), handles different CTEs, and is easily reworked.
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STAYSTIK 571 is a thermoplastic adhesive designed for a variety of electronic applications. It provides excellent bonding at low process temperatures and features a very low elastic modulus of 60,000 psi. Its high compliance allows for reliable bonding between materials with significantly different Thermal Expansion Coefficients (CTEs). The adhesive’s reworkable nature offers distinct advantages in applications where thermoset systems are typically less effective.