STAYSTIK® 181
Silver-filled thermoplastic paste offers strong bonding for electronics, ideal for MCMs, and superior reworkability.
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STAYSTIK 181 Thermoplastic Silver-Filled Paste is designed for a range of electronic applications and delivers excellent bonding performance. Ideal for die and/or substrate attach in hybrid or Multi-Chip Modules (MCMs), its unique reworkable thermoplastic adhesive system provides key advantages in applications where traditional thermoset adhesives fall short.