STAYSTIK® 682

Aluminum nitride-filled thermoplastic film for electronics, offering strong bonding for MCMs and reworkability.

 

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Product Overview

STAYSTIK 682 Thermoplastic Adhesive Film is designed for a variety of electronic applications and delivers excellent bonding performance. It is suitable for die attach and/or substrate attach in hybrid or Multi-Chip Modules (MCMs). The unique reworkable nature of this thermoplastic adhesive system provides significant advantages in applications typically challenging for thermoset adhesives.

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