STAYSTIK® 581
Silver-filled conductive film offers strong bonding for MCMs and superior reworkability compared to thermosets.
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STAYSTIK 581 is a thermoplastic adhesive designed for a variety of electronic applications, offering excellent bonding performance. It is well suited for substrate attachment in hybrid or Multi-Chip Modules (MCMs). Its reworkable formulation provides key advantages in applications where thermoset adhesives are typically less effective.