STAYSTIK® 611
Aluminum nitride-filled film resists high temps, ideal for die attach in hermetic packages, with low RGA and reworkability.
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STAYSTIK 611 Thermoplastic Adhesive Film is ideal for applications requiring resistance to high-temperature excursions. It is suitable for die attach in solder-sealed, hermetic packages and delivers low Residual Gas Analysis (RGA) moisture readings. This high-temperature, reworkable thermoplastic system offers unique advantages in applications where thermoset adhesives are typically less effective.