25 results
MICROFAB® SC
High-speed copper plating process for copper pillars in flip chip packages, copper microbumps in 3D interconnects, and RDL.
Learn moreMICROFAB® SC-32
Acid copper plating process offers excellent throwing power, improved leveling characteristics, and ductile, low-stress deposits.
Learn moreMICROFAB® SC-40
High-speed copper plating process enables flat bump shape, engineered for high-speed pillar, copper stud, and UBM applications.
Learn moreMICROFAB® SC-40 PLUS
Next-generation high-speed copper plating process delivers high-purity deposits with cutting-edge uniformity.
Learn moreMICROFAB® SC-50
High-speed copper plating process delivers accurate bump height uniformity and bump shape control.
Learn moreMICROFAB® SN-300/302
High-speed low-alpha pure tin plating process produces compact grain structures and uniform surface morphology.
Learn moreMICROFAB® SN-350
Low-alpha pure tin plating process enables high-speed electro-deposition of smooth, fine-grained, uniform tin bumps.
Learn moreMICROFAB® TS-650 NXG
Tin-silver bump metallization bath allows high-speed electro-deposition of smooth, fine-grained, uniform tin silver alloy bumps.
Learn moreMICROFAB® SPM-1100
Copper plating solution provides superior coplanarity in a low KV system and exceptional uniformity.
Learn moreMICROFAB® AU660
Mild alkaline non-cyanide gold electroplating process for backside interconnects (via liners) and fine pitch pattern gold bumping.
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