MICROFAB® AU660
Mild alkaline non-cyanide gold electroplating process for backside interconnects (via liners) and fine pitch pattern gold bumping.
Contact UsProduct Overview
MICROFAB AU660 is a mild alkaline, non-cyanide gold electroplating process that produces deposits with 99.99% purity. MICROFAB AU660 enables a single solution for backside interconnect (via liner) and fine-pitch pattern gold bumping. It excels at high plating rates (> 0.5 µm/min) and via step coverage (~2X vs. conventional gold plating), enabling field thinning that can lower the cost of ownership.
Product Features
High Speed Gold Deposition
MICROFAB AU660 exhibits high plating rates greater than 0.5 µm/min and superior via step coverage, ~2X greater than conventional gold plating.
Uniform Post Gold Seed Etch
MICROFAB AU660 provides a uniform post gold seed etch surface roughness.
EH&S Compliant Chemistry
The process is lead-free, arsenic-free and cyanide-free to help customers meet Environment Health & Safety (EH&S) goals.
Surface Roughness Adjustability and Capability
MICROFAB AU660 offers adjustable surface roughness and is capable of achieving <20nm Ra. This solution pairs perfectly with MICROFAB AU100 DEPLATE for superior seed removal uniformity. The process provides 1.5 – 2.0X improved step coverage over conventional gold plating, high plating rates exceeding 0.5 µm/min, and uniform post-seed etch surface roughness.
Featured Applications
Backside Interconnect
MICROFAB AU660 provides a single solution for backside interconnects (via liners).
Bump Plating
MICROFAB AU660 is commonly used for fine-pitch pattern gold bumping on metallized silicon wafers.
Product Documentation
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