MICROFAB® SC-50
High-speed copper plating process delivers accurate bump height uniformity and bump shape control.
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The MICROFAB SC-50 is a high-speed copper plating process designed for copper pillars in flip chip packages, copper microbumps in 3D interconnect packages, and redistribution layers.
This low-stress solution ensures flat bump shapes and provides excellent uniformity within the wafer, die, and features, all in a two-part organic package. The MICROFAB SC-50, derived from the MICROFAB SC family, offers higher plating rates while maintaining consistent performance.