MICROFAB® SN-350
Low-alpha pure tin plating process enables high-speed electro-deposition of smooth, fine-grained, uniform tin bumps.
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The MICROFAB SN-350 is a high-speed, low alpha pure tin plating process that produces compact grain structures and smooth surface morphology, ideal for flip chip bumping and microbump applications.
This organic sulfonate-based electrolyte enables high-speed electro-deposition of smooth, fine-grained, uniform tin bumps. The chemistry is robust enough for both bumping and capping a wide range of patterned wafers, offering excellent post-reflow Within Die (WID) bump thickness uniformity, making it suitable for high-volume manufacturing.