ALPHA OM-358 is a lead-free, zero-halogen, no-clean solder paste designed to provide ultra-low voiding performance on all component types including bottom termination components.
ALPHA OM-358 achieves IPC7095 Class III voiding on BGA components and less than 10% voiding on bottom termination components. This paste is designed for ultra-low voiding performance with high reliability alloys such as Innolot as well as traditional SAC alloys.
- ≤10% voiding on large area bottom terminated components
- Controlled void distribution for enhanced process stability to minimize rework
- Available in T4 powder for Pb-free applications with both Innolot high reliability alloy & SAC305
- Excellent electrochemical reliability on bottom terminated components
Superior void performance and controlled void distribution
ALPHA OM-358 is engineered to provide the lowest voiding performance on large area bottom terminated components. This paste regularly achieves less than 10% voiding on low standoff devices with large termination pads such as QFN, DPAK, and QFP's.
More importantly, ALPHA OM-358 controls the average void distribution from board-to-board to enhance process stability and maintain consistent electrical and thermal performance.