8 results
NOVAFAB® AG-340
Cyanide-free silver electroplating process optimized for Micro-Electromechanical Systems (MEMS) wafer plating applications.
Learn moreNOVAFAB® Pd Acid Strike
Pure palladium acid pre-plate delivers thin Pd deposits for a wide range of current densities and electroplating conditions, specifically optimized for FOWLP solder surfaces.
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A high-purity copper electroplating process formulated for fabricating pillars or pads for hybrid bonding applications.
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High-performance copper process provides superior coplanarity and exceptional within-die, and within-feature uniformity.
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Award-winning advanced electroplating process producing a unique, ultra-pure, copper film for hybrid bonding applications.
Learn moreNOVAFAB® AG-340
Cyanide-free electroplating process designed to deliver superior deposits for wafer plating applications.
Learn moreNOVAFAB® Pd Acid Strike
Pure palladium acid pre-plate delivers thin Pd deposits for a wide range of current densities and electroplating conditions.
Learn moreNOVAFAB® VIA FILL AU
Industry-leading cyanide-, arsenic-, thallium- and lead-free gold process capable of via filling with low surface roughness.
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