NOVAFAB® VIA FILL AU
Industry-leading cyanide-, arsenic-, thallium- and lead-free gold process capable of via filling with low surface roughness.
Contact UsProduct Overview
NOVAFAB VIA FILL AU is a mild alkaline, non-cyanide gold electroplating process that produces deposits of 99.9% purity. NOVAFAB VIA FILL AU is specifically designed to fill vias with a conformal seed.
Product Features
Via fill Capability for Low Aspect Ratio Vias
Designed for low aspect ratio vias commonly found in Micro Light-Emitting Diode (LED) manufacturing and fine-line interconnect trenches. Via fill applications require a conformal seed layer.
Elimination of Voids
NOVAFAB VIA FILL AU eliminates seam voids and achieves superior surface roughness.
EH&S Compliant Chemistry
The process is lead-free, cyanide-free, arsenic-free, and thallium-free, helping customers meet Environment Health & Safety (EH&S) goals.
Low Aspect Ratio Au Via fill
NOVAFAB VIA FILL AU is designed for low aspect ratio vias seam in Micro-LED manufacturing & interconnect lines on Gallium Arsenide devices. All features require using a conformal seed for void free filling. Seam voids are eliminated, and smooth surface roughness is achieved.
Featured Applications
Via fill
NOVAFAB VIA FILL AU is specifically designed to fill vias with a conformal seed.
Product Documentation
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