NOVAFAB® Pd Acid Strike
Pure palladium acid pre-plate delivers thin Pd deposits for a wide range of current densities and electroplating conditions, specifically optimized for FOWLP solder surfaces.
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NOVAFAB® Pd Acid Strike is a high-performance palladium acid pre-plate specifically designed for Fan-Out Wafer Level Packaging (FOWLP) solder surface applications. It delivers thin, uniform palladium deposits across a wide range of current densities and electroplating conditions, ensuring excellent adhesion and compatibility with subsequent metallization processes.
Ideal as either a stand-alone palladium film or a pre-plate layer before further electroplating, NOVAFAB Pd Acid Strike offers precise process control, consistent deposition, and simplified maintenance—optimizing reliability and performance in advanced fan-out wafer-level packaging solder surface fabrication.