NOVAFAB® AG-340
Cyanide-free electroplating process designed to deliver superior deposits for wafer plating applications.
Contact UsProduct Overview
NOVAFAB AG-340 is a cyanide-free electroplating process that delivers deposits with superior physical characteristics, such as excellent purity, solderability, and conductivity, for semiconductor applications. The satin deposits produced by NOVAFAB AG-340 are low stress.
Product Features
Superior Deposits for Semiconductor Applications
NOVAFAB AG-340 delivers uniform, satin deposits with high purity and low sheet resistance.
Adjustable Surface Roughness
NOVAFAB AG-340 enables adjustable surface roughness characteristics.
Excellent Purity and Conductivity
NOVAFAB AG-340 deposits enable excellent purity, solderability, and conductivity, along with simple bath maintenance.
Cyanide-Free Electroplating Process
NOVAFAB AG-340 cyanide-free electroplating process produces satin deposits that are stress-free.
Featured Applications
Wafer Bump Features
NOVAFAB AG-340 cyanide-free electroplating process is designed to deliver superior deposits for wafer bump features.
Electrical Test
High purity and conductivity make NOVAFAB AG-340 ideal for electrical test devices.
Sintered Die Attach
Adjustable surface roughness characteristics make it ideal for integration with sintered die attach materials.
Product Documentation
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