7 results
ALPHA® HiTech® AD13-9692B Adhesive
A one-component, low-temperature cure epoxy system, designed for bonding heat-sensitive devices and camera module applications.
Learn moreALPHA® HiTech® EN21-4210F Encapsulant
A one-component epoxy system designed to encapsulate the chip component to protect the device and strengthen the solder joints.
Learn moreALPHA® HiTech® SM42-120P Adhesive
A one-component, fast-curing surface mount adhesive, specifically designed for screen printing.
Learn moreALPHA® HiTech® UP44-5566T Adhesive
One-component UV cure system designed for fast curing and bonding in various applications, including coating and component fixing.
Learn moreALPHA® HiTech® AD13-9521B
A single-component epoxy cures at low temperatures, offering water resistance and bonding FPCB to various plastic materials.
Learn moreALPHA® HiTech® AD13-9692B
A single-component epoxy system ideal for bonding heat-sensitive devices and designed for camera module applications.
Learn moreALPHA® HiTech® UP44-5566T
A UV-curing system, suitable for rapid curing and bonding in diverse applications, including coating and component fixing.
Learn moreHave a question? Let us help you.
We are here to help you. Please feel free to contact us with questions, comments or feedback.