ALPHA® HiTech® UP44-5566T
A UV-curing system, suitable for rapid curing and bonding in diverse applications, including coating and component fixing.
Contact UsProduct Overview
A versatile, high-performance underfill adhesive specifically developed for electronics assembly applications. This single-component adhesive provides excellent reliability and protection for delicate components, particularly in Surface-Mount Technology (SMT) and flip-chip assemblies. ALPHA® HiTech UP44-5566T offers a fast curing process, ensuring high throughput in production.
Product Features
Fast UV Cure
This adhesive cures quickly under ultraviolet light, enabling faster processing times and making it ideal for high-volume manufacturing.
Excellent Adhesion
ALPHA® HiTech® UP44-5566T provides strong adhesion to various substrates, enhancing the stability and longevity of bonded components.
Halogen-Free Composition
The adhesive is halogen-free and Restriction of Hazardous Substances (RoHS) compliant, ensuring environmental safety and compliance with global regulatory standards.
Halogen-Free Composition
The product is RoHS-compliant and free from halogens, making it a safer choice for environmentally conscious manufacturing while reducing harmful substances in the supply chain.
Controlled Viscosity and Thixotropic Properties
The adhesive’s viscosity and thixotropic index contribute to precise application control, which is essential for camera modules, where tight tolerances and clean lines are critical.
Featured Applications
Lens Bonding
Ensures the secure attachment of lenses within camera modules, offering fast curing and strong adhesion for precise alignment.
Image Sensor Fixation
Provides reliable bonding for image sensors, maintaining stability and alignment to ensure optimal image quality and durability.
Flexible Printed Circuit (FPC) Attachment
Facilitates the secure attachment of FPC components, essential for flexibility and performance in compact camera modules.
IR Filter Bonding
Ideal for bonding IR filters, contributing to improved camera functionality by providing a fast-curing, stable adhesive layer that withstands environmental stressors.