ALPHA® HiTech® AD13-9692B
A single-component epoxy system ideal for bonding heat-sensitive devices and designed for camera module applications.
Contact UsProduct Overview
A one-component, low-temperature curing epoxy adhesive designed specifically for bonding heat-sensitive devices. Ideal for applications in camera modules and other optical devices where low thermal exposure is critical, the AD13-9692B offers strong adhesion at temperatures low enough to prevent damage to sensitive components, while maintaining flexibility in automated manufacturing.
Product Features
Low-Temperature Cure
Allows for effective bonding at temperatures as low as 80°C, reducing the risks of heat damage to sensitive components.
Single-Component Adhesive
Simplifies the manufacturing process by eliminating the need for mixing, helping to maintain consistent quality.
High Adhesion on Diverse Substrates
Compatible with substrates like stainless steel, polyimide, and Liquid Crystal Polymer (LCP), broadening its range of applications.
Low Curing Temperature at 80 °C for 30 Minutes
This low-temperature curing enables the adhesive to bond effectively without risking damage to sensitive camera module components, making it ideal for assemblies that require minimal thermal exposure.
Excellent Adhesion to LCP, Polycarbonate (PC)
The strong bonding capability with diverse substrates, such as LCP and PC, ensures reliable attachment within camera modules, offering flexibility for various materials commonly used in these applications.
Coefficient of Thermal Expansion (CTE) α1
CTE: 55 ppm, α2: 175 ppm. These CTE values accommodate thermal expansion and contraction, helping maintain adhesive integrity and prevent misalignment in camera modules during temperature fluctuations.
Glass Transition Temperature (Tg) of 45 °C
This moderate Tg supports stable performance under typical operating conditions for camera modules, keeping the adhesive effective across a range of environmental stresses.
Featured Applications
Camera Modules
Ensures stable adhesion for optical devices that require precise and reliable assembly under low-temperature conditions.