ALPHA® HiTech® AD13-9521B
A single-component epoxy cures at low temperatures, offering water resistance and bonding FPCB to various plastic materials.
Contact UsProduct Overview
A high-performance, one-component epoxy adhesive designed for bonding applications in electronics manufacturing. It provides excellent adhesion to a variety of substrates, including metals, ceramics, and plastics, making it versatile for diverse assembly needs. This adhesive cures quickly at low temperatures, minimizing thermal stress on sensitive components and enabling efficient production processes.
Product Features
Fast, Low-Temperature Cure
It cures quickly at low temperatures, making it ideal for heat-sensitive components, ensuring reliability while minimizing thermal stress during assembly.
Halogen-Free and RoHS Compliant
This product meets environmental safety standards, providing a compliant solution for industries requiring eco-friendly materials.
High Adhesion
Suitable for a range of materials, it delivers strong bonding capabilities, even on challenging surfaces like Liquid Crystal Polymer (LCP) and metals.
Low-Temperature Cure
Designed to cure at lower temperatures, this adhesive minimizes heat exposure, which is crucial for protecting sensitive camera module components and maintaining overall assembly integrity.
High Adhesion to Diverse Substrates
With excellent bonding capabilities to materials like polycarbonate and LCP, it ensures reliable, durable adhesion across a range of commonly used camera module substrates, enhancing overall module stability.
Thermal Expansion Compatibility
Featuring a controlled Coefficient of Thermal Expansion (CTE), this adhesive accommodates thermal shifts, helping prevent misalignment or detachment under varying temperature conditions, which is essential for ensuring precision in camera modules.
Optimized Viscosity and Flow Properties
Its formulation supports controlled application, reducing the risk of bleed-out or excess adhesive spread, which helps maintain clarity and performance in optical assemblies.
Featured Applications
Heat-Sensitive
Perfect for electronic components that are sensitive to high-temperature processing, such as those found in computing and communication devices.
Automotive
Used for sensors and modules that require reliable bonding and compliance with automotive-grade standards.
Industrial
Ideal for devices in harsh environments, thanks to its high adhesion and thermal stability.