ALPHA® HiTech® EN21-4210F Encapsulant
A one-component epoxy system designed to encapsulate the chip component to protect the device and strengthen the solder joints.
Contact UsProduct Overview
ALPHA HiTech EN21-4210F has a high hardness property, making it ideal for assembling components that require excellent reinforcement strength.
The ALPHA HiTech EN21-4210 is a non-reworkable encapsulant product option.
Product Features
Excellent Adhesion Strength
Imparts Waterproofing Properties
Resists Migration in Flux Residue
Halogen-Free
Complies with RoHS Directive 2015/863/EU
Encapsulant for Reinforcement and Environmental Protection
ALPHA HiTech EN21-4210F Encapsulant provides the necessary coverage for areas in the assembly requiring waterproofing.
It also inhibits migration from flux residue, offering protection against cracking in encapsulated chip components. With excellent adhesion to metals and FR4, it ensures reliable performance.
Related Applications
ALPHA HiTech Adhesives cover a wide range of applications for holding chip components or bonding devices under varying curing conditions.
ALPHA HiTech Encapsulants are one-component, intermediate-temperature, fast-heat curable materials designed to mechanically protect assembled chips and Integrated Circuit (IC) devices from dropping off and cracking.
