963 results

Enklad

Advanced cleaning, etching, and zincate processes for superior nickel coatings on aluminum memory disks.

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ENVISION®

Polymer-based direct metallization for PCBs enhances board capacity and performance.

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Exactalloy®

Precision solder preforms ensure accurate volumes, improving reliability and efficiency in electronics assembly.

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HiFlo®

Purest, high-fluidity solder made from virgin metals for unmatched performance and minimal dross.

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HiTech®

Drop Shock, Impact Bend, and ATC-tested adhesives, underfills, and encapsulants for soldered components.

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Innolot®

High-reliability, lead-free solder alloy for robust performance in harsh environments.

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MacDermid Alpha Showcases Advanced Soldering Materials for High-Reliability Electronics Assembly at NEPCON Thailand 2026

We will present our latest materials technologies at NEPCON Thailand 2026, held June 17 to 20 at the Bangkok International Trade & Exhibition Centre (BITEC), Thailand.

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Engineering Copper Grain Structure for High-Yield Hybrid Bonding in 3D Packaging

Why copper grain size matters for hybrid bonding and how to control it for HBM and chiplets. Read the article here.

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