963 results

Kester®

Circuit board assembly materials including traditional soldering chemicals, paste, wire, and bar products. 

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M-Copper Omega®

Premium electroless copper for primary PCB metallization, ensuring high reliability.

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MICROFAB®

High-quality copper, gold, and solder for WLP, meeting demands of IDM, OSAT, and foundries.

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MultiPrep

Advanced copper treatment, promoting adhesion for innerlayer and soldermask applications.

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PALLADEX®

Electrolytic palladium plating for reliable connectors and interconnects.

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Reliance®

A unique, patent-pending reliability toolset integrating solder and polymer data insights for unmatched circuit board assembly perform

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Shadow®

Sustainable graphite-based direct metallization, a cleaner alternative to electroless copper.

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STAYDRY®

Advanced moisture, particle, and hydrogen getters designed to enhance performance and reliability across diverse applications.

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STAYSTIK®

Versatile adhesives delivering reliable mechanical, electrical, and thermal bonding for both temporary and permanent applications.

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Systek

Comprehensive IC substrate metallization processes for RDL, through-hole filling, and embedded traces.

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