963 results
ATROX®
High-performance conductive and non-conductive die-attach pastes and films for power semiconductors and discrete assemblies.
Learn moreComputing
Boost yields and reduce costs with solder, polymer, and circuit solutions for fast assembly and high-speed data processing.
Learn moreCompugraphics®
Delivering reliable, high-precision photomask solutions that ensure quality, speed, and flexibility to meet your manufacturing needs.
Learn moreViaForm®
Copper damascene chemistries that deliver proven uniform interconnect fill and superior reliability for wafer fabrication.
Learn moreAffinity™
ENIG and ENEPIG final finishes for reliable wire bonding and superior solderability in advanced packaging designs.
Learn moreENTEK®
Trusted organic solderability preservatives, proven in production across diverse lead-free assembly applications.
Learn moreMacuSpec™
High-performance electrolytic copper processes for the plating of through holes and filling of micro vias.
Learn moreORMECON®
Extremely stable immersion tin process with exceptional solderability, even after multiple lead-free assembly reflows.
Learn moreSterling®
Delivers exceptional solder joint strength, touchpad functionality, wire bondability, and in-circuit test compatibility.
Learn morePowerBond®
High-strength solder with superior thermal fatigue, close to high-lead alloy performance.
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