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Award Winning NOVAFAB® Fine Grain Copper Electroplating Process for Hybrid Bonding Applications
MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to have received the 3D InCites Technology Enablement Award for its latest advanced packaging solution, the NOVAFAB Fine Grain Copper electroplating process.
Learn moreDirect Metallization: A Future-Ready Solution for Advanced Electronic Applications
Read this article and find out how direct metallization makes PCB manufacturing more sustainable, efficient, and cost-effective.
Learn moreMacDermid Alpha Expands Laboratory Facilities in Thailand to Strengthen Regional Innovation and Customer Collaboration
Bangkok, Thailand laboratory boosts advanced analysis capabilities for electronics customers across Southeast Asia
Learn moreFrom Paste to Precision: Advancing Semiconductor Reliability with Silver Sintering AccuLam
From paste to precision, learn how silver sintering AccuLam is redefining semiconductor reliability through advanced thermal management, consistent bondline control, and PFAS-free sustainability.
Learn moreMacDermid Alpha Electronics Solutions Announces Agreement to Acquire Micromax®
Big news in electronics materials: Element Solutions Inc signed a definitive agreement to acquire Micromax® from Celanese Corporation.
Learn moreDirect Metallization: A Game-Changer for the Electronics Industry
Want a smarter, more sustainable alternative to electroless copper? Read this article to learn how direct metallization delivers.
Learn moreAdvanced Preform Solutions TrueHeight Spacers Brochure - English
Advanced Preform Solutions TrueHeight Spacers Brochure - English
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