10 results

ATROX® 800HT2V-P1

A thermosetting conductive die attach with very high thermal conductivity designed for high power semiconductor packages.

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ATROX® 800HT7A

An ultra-low stress Hybrid Silver sintered die attach paste with high thermal conductivity set for high power exposed pad semiconductors.

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ATROX® 590-4HT1

Low-stress, thermally conductive die attach adhesive for high-power and exposed pad semiconductor packages.

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ATROX® 800HT2V

A thermosetting conductive die attach with very high thermal conductivity designed for high power semiconductor packages.

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ATROX® 800HT6B

Ultra-low stress, thermally conductive die attach for high-power, exposed pad semiconductor applications.

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ATROX® CD 560-1

Zero PFAS die attach paste for high-throughput automated dispensing in metal lead frame packages.

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ATROX® CD 590-HT2

Thermosetting conductive die attach for substrate and metal lead frame packages

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ATROX® 558-2C31

The ATROX brand of conductive die attach pastes are designed to provide you with superior performance for today's stringent reliability requirements.

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ATROX® 850HT1

Conductive die attach pastes offer excellent performance to meet today's high reliability standards.

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ATROX® 800HT2VX

PFAS-free, conductive die attach products deliver a cost-effective, high-performance solution, leading the way in advanced materials.

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