ATROX® CD 560-1

Zero PFAS die attach paste for high-throughput automated dispensing in metal lead frame packages.

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Product Overview

ATROX® CD 560-1 offers excellent substrate compatibility and low Resin Bleed-Out (RBO), ensuring reliable bonding to Pre-Plated Frame (PPF) and copper lead frames. It provides a long pot life of over 24 hours at room temperature and maintains a 12-month shelf life when stored at -40ºC. Additionally, its low outgassing properties help minimize contamination, supporting high-quality and reliable performance. 

Product Features

CS3 - Markets Landing High Speed Computing
High Reliability

Achieves MSL-1 performance and zero delamination on leadframe packages.

Flexible Manufacturability

Box oven- and snap-cure capable

High Throughput Automated Dispensing

Optimum rheology* maximizes throughput with minimal machine downtime.

Excellent Substrate Compatibility and Shelf Stability

This material delivers reliable bonding to Pre-Plated Frame (PPF) and copper lead frames while maintaining low Resin Bleed-Out (RBO). It provides more than 24 hours of pot life at room temperature and offers a 12-month shelf life when stored at -40ºC. With its low outgassing properties, it minimizes contamination, ensuring high performance and long-term reliability even in the most demanding applications.

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