ATROX® 800HT2VX
PFAS-free, conductive die attach products deliver a cost-effective, high-performance solution, leading the way in advanced materials.
Contact UsProduct Overview
A hybrid silver sintered die attach paste designed for high-power semiconductor packages with metallized dies. It features exceptional thermal conductivity, low resin bleed-out, and minimal condensable organics, ensuring outstanding package reliability in demanding applications such as automotive and 5G technology. This pressureless attachment solution supports high-temperature operations and enables high-volume manufacturing.
Product Features
Hybrid Silver Sintered Composition
A hybrid silver sintered composition that delivers exceptional thermal conductivity, ensuring efficient heat dissipation.
PFAS-Free Formulation
PFAS-free, in compliance with environmental regulations, the elimination of per- and Polyfluoroalkyl Substances (PFAS) ensures safer handling and application.
Chemical Type: Thermosetting
As a thermosetting adhesive, ATROX® 800HT2VX cures into a strong, permanent bond, withstanding high temperatures and mechanical stress. This makes it ideal for die attach in high-power semiconductor applications, where durability and thermal stability are essential for long-term performance.
Appearance: Grey
The grey color of the adhesive provides a uniform appearance, aiding in visual inspections and quality control during the assembly process. This consistency allows manufacturers to easily identify any application anomalies that could affect bonding quality.
Viscosity at 25°C at 5RPM: 58,000 CPs
The high viscosity of 58,000 CPs ensures that the paste remains in place during application, reducing the risk of slumping or spreading. This stability is crucial for precise placement on die attach pads, improving process control and repeatability in production.
Thixotropic Index: 5.0
With a thixotropic index of 5.0, the paste becomes less viscous under stress, allowing for easy dispensing while maintaining its shape after application. This property provides smooth application and prevents excessive spreading, resulting in accurate and clean die attach placements.
Pot Life @ 23°C: > 25 Hours
With a pot life of over 25 hours at room temperature, the adhesive remains usable for extended periods, minimizing waste and enhancing production efficiency. This extended pot life offers flexibility for operators, allowing for larger batch processing without the concern of premature curing.
Featured Applications
RF Amplifiers
The high viscosity and thixotropic properties of ATROX® 800HT2VX enable precise application in high-power Radio Frequency (RF) amplifiers.
Automotive
With strong adhesion even under high temperatures, ATROX® 800HT2VX is ideal for die attach in automotive applications.
LED Devices
The sub-micron particle size of ATROX® 800HT2VX enables a low bond line thickness without voiding, making it ideal for applications in Light-Emitting Diode (LED) devices.
Power Management ICs
Supports high yield and throughput in automated manufacturing processes, making it an excellent choice for die attach in power Integrated Circuits (ICs).