ATROX® 558-2C31
The ATROX brand of conductive die attach pastes are designed to provide you with superior performance for today's stringent reliability requirements.
Contact UsProduct Overview
ATROX conductive die attach products provide a comprehensive solution with a reduced total cost of ownership, ushering in a new era of high-performance materials.
Product Features
Thermal Conductivity
The ATROX 558-2C31 offers good thermal conductivity, greater than 5 W/m-K, making it ideal for applications that require efficient heat dissipation.
Compatibility with Multi Leadframe Surfaces
This adhesive is compatible with various leadframe surfaces, including Copper (Cu) and pre-plated frames (NiPdAu), offering versatility in packaging.
Low Outgassing and Moisture Resistance
It features low outgassing properties and excellent moisture resistance, enhancing its performance and longevity in high-reliability environments.
Medium to Large Die Support
The adhesive is optimized for medium to large die sizes, up to 100 mm², providing stability with reduced material stress.
Hybrid Silver Sintering Technology
ATROX 558-2C31 uses a hybrid silver sintering mechanism, enhancing reliability under high thermal and mechanical stress conditions.
Featured Applications
Power Semiconductors
It is commonly used in power semiconductor and power discrete device packaging, where efficient thermal management and mechanical stability are critical.
Medical / Aerospace
Its reliability and low outgassing make it ideal for sensitive applications, such as medical devices and aerospace components.