25 results
MICROFAB® AU3151
Mild alkaline non-cyanide high-purity hardness gold electroplating process with proven reliability and bondability.
Learn moreMICROFAB® AU100 CT DEPLATE
Non-cyanide gold seed deplate reduces costs by selectively stripping gold seed metallization.
Learn moreMICROFAB® AU660
Mild alkaline, non-cyanide gold electroplating process for MEMS, ideal for backside interconnects (via liners) and fine-pitch pattern gold bumping with superior coverage.
Learn moreMICROFAB® AU660
Mild alkaline non-cyanide gold electroplating process for backside interconnects (via liners) and fine pitch pattern gold bumping.
Learn moreMICROFAB® AU310-T
Gold electroplating process provides an arsenic-free bright plating solution with superior surface roughness for fine pitch bumping.
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