MICROFAB® AU310-T

Gold electroplating process provides an arsenic-free bright plating solution with superior surface roughness for fine pitch bumping.

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Product Overview

MICROFAB AU310-T is a mild alkaline non-cyanide gold electroplating process that produces deposits of 99.99% purity. It enables an arsenic-free bright plating solution with superior surface roughness for fine pitch pattern gold bumping. Frequently used in bump plating on metalized silicon wafers.

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