MICROFAB® AU660
Mild alkaline, non-cyanide gold electroplating process for MEMS, ideal for backside interconnects (via liners) and fine-pitch pattern gold bumping with superior coverage.
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MICROFAB AU660 is a high-purity (99.99%) gold electroplating process engineered for Micro-Electromechanical Systems (MEMS). Ideal for backside interconnects (via liners) and fine-pitch gold bumping, it provides excellent step coverage—approximately twice that of conventional gold plating—while maintaining high plating rates (>0.5 µm/min). MICROFAB AU660 supports field thinning and cost-efficient production, making it a reliable choice for metallized silicon wafers in advanced MEMS fabrication.